Issued Patents 2011
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8072062 | Circuit device with at least partial packaging and method for forming | Jie Zhao, Edward R. Prack, Robert J. Wenzel, Brian D. Sawyer, David G. Wontor +1 more | 2011-12-06 |
| 7950144 | Method for controlling warpage in redistributed chip packaging panels | Lakshmi N. Ramanathan, Douglas G. Mitchell, Betty Hill-Shan Yeung | 2011-05-31 |
| 7892882 | Methods and apparatus for a semiconductor device package with improved thermal performance | Victor A. Chiriac, Tien-Yu Lee, Marc Alan Mangrum, Robert J. Wenzel | 2011-02-22 |