Issued Patents 2011
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8072062 | Circuit device with at least partial packaging and method for forming | George R. Leal, Jie Zhao, Edward R. Prack, Robert J. Wenzel, Brian D. Sawyer +1 more | 2011-12-06 |
| 8059380 | Package level ESD protection and method therefor | Sergio A. Ajuria, Melanie Etherton | 2011-11-15 |
| 8044494 | Stackable molded packages and methods of making the same | Addi B. Mistry, David Patten, Jesse Phou, Ziep Tran | 2011-10-25 |
| 7892882 | Methods and apparatus for a semiconductor device package with improved thermal performance | George R. Leal, Victor A. Chiriac, Tien-Yu Lee, Robert J. Wenzel | 2011-02-22 |