Issued Patents 2011
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7989951 | Die assemblies | David J. Dougherty | 2011-08-02 |
| 7950144 | Method for controlling warpage in redistributed chip packaging panels | Lakshmi N. Ramanathan, George R. Leal, Douglas G. Mitchell | 2011-05-31 |