Issued Patents 2011
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7981730 | Integrated conformal shielding method and process using redistributed chip packaging | Jinbang Tang, Darrel R. Frear, Scott M. Hayes | 2011-07-19 |
| 7950144 | Method for controlling warpage in redistributed chip packaging panels | Lakshmi N. Ramanathan, George R. Leal, Betty Hill-Shan Yeung | 2011-05-31 |
| 7935571 | Through substrate vias for back-side interconnections on very thin semiconductor wafers | Chandrasekaram Ramiah, Michael F. Petras, Paul W. Sanders | 2011-05-03 |