Issued Patents 2011
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8004068 | Shielded multi-layer package structures | Jong-Kai Lin | 2011-08-23 |
| 7981730 | Integrated conformal shielding method and process using redistributed chip packaging | Darrel R. Frear, Scott M. Hayes, Douglas G. Mitchell | 2011-07-19 |
| 7977785 | Electronic device including dies, a dielectric layer, and a encapsulating layer | — | 2011-07-12 |
| 7969164 | Method and apparatus for mini module EMI shielding evaluation | James E. Drye, Scott M. Hayes | 2011-06-28 |
| 7869225 | Shielding structures for signal paths in electronic devices | Jong-Kai Lin, Ronald V. McBean | 2011-01-11 |