Issued Patents 2011
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8062975 | Through substrate vias | Paul W. Sanders, Chandrasekaram Ramiah | 2011-11-22 |
| 7935571 | Through substrate vias for back-side interconnections on very thin semiconductor wafers | Chandrasekaram Ramiah, Douglas G. Mitchell, Paul W. Sanders | 2011-05-03 |