Issued Patents 2011
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8072062 | Circuit device with at least partial packaging and method for forming | George R. Leal, Jie Zhao, Edward R. Prack, Robert J. Wenzel, Brian D. Sawyer +1 more | 2011-12-06 |
| 8053349 | BGA package with traces for plating pads under the chip | Kenneth Robert Rhyner, Kevin Lyne, Peter R. Harper | 2011-11-08 |