Issued Patents 2011
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8053349 | BGA package with traces for plating pads under the chip | Kenneth Robert Rhyner, Kevin Lyne, David G. Wontor | 2011-11-08 |
| 8049320 | Integrated circuit stacked package precursors and stacked packaged devices and systems therefrom | Kenneth J. Maggio | 2011-11-01 |
| 7919860 | Semiconductor device having wafer level chip scale packaging substrate decoupling | Rajen Manicon Murugan, Robert F. McCarthy, Baher Haroun | 2011-04-05 |