Issued Patents 2005
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6909170 | Semiconductor assembly with package using cup-shaped lead-frame | Mike F. Chang, King Owyang, Yueh-Se Ho, Lixiong Luo, Wei-Bing Chu | 2005-06-21 |
| 6876061 | Chip scale surface mount package for semiconductor device and process of fabricating the same | Felix Zandman, Yueh-Se Ho | 2005-04-05 |