Issued Patents 2005
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6909170 | Semiconductor assembly with package using cup-shaped lead-frame | King Owyang, Yueh-Se Ho, Y. Mohammed Kasem, Lixiong Luo, Wei-Bing Chu | 2005-06-21 |
| 6841852 | Integrated circuit package for semiconductor devices with improved electric resistance and inductance | Leeshawn Luo, Anup Bhalla, Yueh-Se Ho, Sik Lui | 2005-01-11 |