Issued Patents 2005
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6909170 | Semiconductor assembly with package using cup-shaped lead-frame | Mike F. Chang, King Owyang, Yueh-Se Ho, Y. Mohammed Kasem, Lixiong Luo | 2005-06-21 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6909170 | Semiconductor assembly with package using cup-shaped lead-frame | Mike F. Chang, King Owyang, Yueh-Se Ho, Y. Mohammed Kasem, Lixiong Luo | 2005-06-21 |