Issued Patents 2005
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6909170 | Semiconductor assembly with package using cup-shaped lead-frame | Mike F. Chang, King Owyang, Y. Mohammed Kasem, Lixiong Luo, Wei-Bing Chu | 2005-06-21 |
| 6876061 | Chip scale surface mount package for semiconductor device and process of fabricating the same | Felix Zandman, Y. Mohammed Kasem | 2005-04-05 |
| 6841852 | Integrated circuit package for semiconductor devices with improved electric resistance and inductance | Leeshawn Luo, Anup Bhalla, Sik Lui, Mike F. Chang | 2005-01-11 |