Issued Patents 2005
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6977429 | Manufacturing system and apparatus for balanced product flow with application to low-stress underfilling of flip-chip electronic devices | Charles Odegard, Vinu Yamunan | 2005-12-20 |
| 6903000 | System for improving thermal stability of copper damascene structure | Jiong-Ping Lu, Qi-Zhong Hong, Changming Jin, David Permana, Ting Tsui | 2005-06-07 |
| 6861292 | Composite lid for land grid array (LGA) flip-chip package assembly | — | 2005-03-01 |