Issued Patents 2005
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6903000 | System for improving thermal stability of copper damascene structure | Jiong-Ping Lu, Qi-Zhong Hong, Tz-Cheng Chiu, Changming Jin, David Permana | 2005-06-07 |
| 6881665 | Depth of focus (DOF) for trench-first-via-last (TFVL) damascene processing with hard mask and low viscosity photoresist | Stephen Keetai Park, Christian Zistl | 2005-04-19 |