Issued Patents 2005
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6958290 | Method and apparatus for improving adhesion between layers in integrated devices | Richard Allen Faust, Qing Jiang | 2005-10-25 |
| 6927159 | Methods for providing improved layer adhesion in a semiconductor device | Richard Allen Faust | 2005-08-09 |
| 6903000 | System for improving thermal stability of copper damascene structure | Qi-Zhong Hong, Tz-Cheng Chiu, Changming Jin, David Permana, Ting Tsui | 2005-06-07 |
| 6861695 | High-k dielectric materials and processes for manufacturing them | Ming-Jang Hwang | 2005-03-01 |