Issued Patents 2005
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6958290 | Method and apparatus for improving adhesion between layers in integrated devices | Richard Allen Faust, Jiong-Ping Lu | 2005-10-25 |
| 6951812 | Copper transition layer for improving copper interconnection reliability | Robert Tsu, Kenneth D. Brennan | 2005-10-04 |
| 6911394 | Semiconductor devices and methods of manufacturing such semiconductor devices | Changming Jin, Joseph D. Luttmer | 2005-06-28 |