Issued Patents 2005
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6951812 | Copper transition layer for improving copper interconnection reliability | Qing Jiang, Robert Tsu | 2005-10-04 |
| 6911389 | Self aligned vias in dual damascene interconnect, buried mask approach | Paul Gillespie | 2005-06-28 |
| 6903918 | Shielded planar capacitor | — | 2005-06-07 |