Issued Patents 2005
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6977429 | Manufacturing system and apparatus for balanced product flow with application to low-stress underfilling of flip-chip electronic devices | Vinu Yamunan, Tz-Cheng Chiu | 2005-12-20 |
| 6869831 | Adhesion by plasma conditioning of semiconductor chip surfaces | Marvin W. Cowens, Masood Murtuza, Vinu Yamunan, Phillip R. Coffman | 2005-03-22 |
| 6855578 | Vibration-assisted method for underfilling flip-chip electronic devices | Willmar Subido | 2005-02-15 |