Issued Patents 2005
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6900534 | Direct attach chip scale package | — | 2005-05-31 |
| 6888255 | Built-up bump pad structure and method for same | Muthiah Venkateswaran, Satyendra Singh Chauhan | 2005-05-03 |
| 6869831 | Adhesion by plasma conditioning of semiconductor chip surfaces | Marvin W. Cowens, Vinu Yamunan, Charles Odegard, Phillip R. Coffman | 2005-03-22 |
| 6849944 | Using a supporting structure to control collapse of a die towards a die pad during a reflow process for coupling the die to the die pad | Muthiah Venkateswaran, Satyendra Singh Chauhan | 2005-02-01 |