Issued Patents 2005
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6888255 | Built-up bump pad structure and method for same | Masood Murtuza, Satyendra Singh Chauhan | 2005-05-03 |
| 6849944 | Using a supporting structure to control collapse of a die towards a die pad during a reflow process for coupling the die to the die pad | Masood Murtuza, Satyendra Singh Chauhan | 2005-02-01 |