Issued Patents 2005
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6974659 | Method of forming a solder ball using a thermally stable resinous protective layer | Chao-Yuan Su, Chia-Fu Lin, Hsin-Hui Lee, Kai-Ming Ching, Li-Chih Chen | 2005-12-13 |
| 6956292 | Bumping process to increase bump height and to create a more robust bump structure | Yang-Tung Fan, Cheng-Yu Chu, Fu-Jier Fan, Shih-Jane Lin, Chiou-Shian Peng +1 more | 2005-10-18 |
| 6936923 | Method to form very a fine pitch solder bump using methods of electroplating | Kuo-Wei Lin, Cheng-Yu Chu, Yang-Tung Fan, Fu-Jier Fan, Chiou-Shian Peng +1 more | 2005-08-30 |
| 6923683 | High density interconnection device | Harjinder Dulai, Colin Szeto, Edward J. Laurin, Steven D. Daniels, Jean-Francois Drolet | 2005-08-02 |
| 6876049 | Colors only process to reduce package yield loss | Yang-Tung Fan, Chiou-Shian Peng, Cheng-Yu Chu, Shih-Jane Lin, Fu-Jier Fan +1 more | 2005-04-05 |