Issued Patents 2005
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6974659 | Method of forming a solder ball using a thermally stable resinous protective layer | Chia-Fu Lin, Hsin-Hui Lee, Yen-Ming Chen, Kai-Ming Ching, Li-Chih Chen | 2005-12-13 |