Issued Patents 2005
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6974659 | Method of forming a solder ball using a thermally stable resinous protective layer | Chao-Yuan Su, Chia-Fu Lin, Hsin-Hui Lee, Yen-Ming Chen, Li-Chih Chen | 2005-12-13 |
| 6926818 | Method to enhance the adhesion between dry film and seed metal | Yih-Ann Lin, Tung-Heng Shie, Sheng-Liang Pan, Kuo-Liang Lu | 2005-08-09 |
| 6918397 | Flush system for dry film photoresist remover | Ta-Min Lin, Szu-Yao Wang, Chia-Fu Lin, Wen-Hsiang Tseng | 2005-07-19 |