Issued Patents 2005
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6956292 | Bumping process to increase bump height and to create a more robust bump structure | Cheng-Yu Chu, Fu-Jier Fan, Shih-Jane Lin, Chiou-Shian Peng, Yen-Ming Chen +1 more | 2005-10-18 |
| 6936923 | Method to form very a fine pitch solder bump using methods of electroplating | Kuo-Wei Lin, Cheng-Yu Chu, Yen-Ming Chen, Fu-Jier Fan, Chiou-Shian Peng +1 more | 2005-08-30 |
| 6876049 | Colors only process to reduce package yield loss | Chiou-Shian Peng, Cheng-Yu Chu, Shih-Jane Lin, Yen-Ming Chen, Fu-Jier Fan +1 more | 2005-04-05 |