Issued Patents 2005
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6979901 | Semiconductor heat-dissipating substrate, and manufacturing method and package therefor | Kouichi Takashima, Shin-ichi Yamagata, Akira Sasame | 2005-12-27 |
| 6974558 | Susbstrate material for mounting a semiconductor device, substrate for mounting a semiconductor device, semiconductor device, and method of producing the same | Shinichi Yamagata, Makoto Imamura, Akira Fukui, Yoshishige Takano, Takatoshi Takikawa +1 more | 2005-12-13 |