Issued Patents 2005
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6979901 | Semiconductor heat-dissipating substrate, and manufacturing method and package therefor | Kouichi Takashima, Yugaku Abe, Akira Sasame | 2005-12-27 |
SY
Shin-ichi Yamagata
Overall (2005): #101,010 of 245,428Top 45%
1
Patents 2005