Issued Patents 2005
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6979901 | Semiconductor heat-dissipating substrate, and manufacturing method and package therefor | Kouichi Takashima, Shin-ichi Yamagata, Yugaku Abe | 2005-12-27 |
AS
Akira Sasame
Overall (2005): #241,941 of 245,428Top 100%
1
Patents 2005