Issued Patents 2005
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6902101 | Bump bonding method apparatus | Satoshi Horie, Hiroyuki Kiyomura, Tetsuya Tokunaga, Tatsuo Sasaoka | 2005-06-07 |
| 6894387 | Semiconductor element having protruded bump electrodes | Kazushi Higashi, Norihito Tsukahara, Yoshihiko Yagi, Yoshifumi Kitayama, Hiroyuki Otani | 2005-05-17 |