Issued Patents 2005
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6910613 | Device and method for forming bump | Shoriki Narita, Koichi Yoshida, Masahiko Ikeya, Takaharu Mae, Shinji Kanayama +3 more | 2005-06-28 |
| 6894387 | Semiconductor element having protruded bump electrodes | Norihito Tsukahara, Takahiro Yonezawa, Yoshihiko Yagi, Yoshifumi Kitayama, Hiroyuki Otani | 2005-05-17 |