Issued Patents 2005
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6971167 | Multilayered circuit board forming method and multilayered circuit board | Kazuhiro Nishikawa, Norihito Tsukahara | 2005-12-06 |
| 6926796 | Electronic parts mounting method and device therefor | Kazuto Nishida, Hidenobu Nishikawa, Yoshinori Wada | 2005-08-09 |
| 6894387 | Semiconductor element having protruded bump electrodes | Kazushi Higashi, Norihito Tsukahara, Takahiro Yonezawa, Yoshihiko Yagi, Yoshifumi Kitayama | 2005-05-17 |