Issued Patents 2005
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6971167 | Multilayered circuit board forming method and multilayered circuit board | Kazuhiro Nishikawa, Hiroyuki Otani | 2005-12-06 |
| 6894387 | Semiconductor element having protruded bump electrodes | Kazushi Higashi, Takahiro Yonezawa, Yoshihiko Yagi, Yoshifumi Kitayama, Hiroyuki Otani | 2005-05-17 |