Issued Patents 2005
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6861288 | Stacked semiconductor packages and method for the fabrication thereof | Il Kwon Shim, Kambhampati Ramakrishna, Byung Joon Han | 2005-03-01 |
| 6841858 | Leadframe for die stacking applications and related die stacking concepts | Il Kwon Shim, Kambhampati Ramakrishna | 2005-01-11 |