Issued Patents 2005
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6979907 | Integrated circuit package | Jian Li, Guruprasad G. Badakere | 2005-12-27 |
| 6960493 | Semiconductor device package | Virgil Ararao, Hermes T. Apale | 2005-11-01 |
| 6943057 | Multichip module package and fabrication method | Dario S. Filoteo, Jr., Tsz Yin Ho, Sebastian T. M. Soon | 2005-09-13 |
| 6875634 | Heat spreader anchoring and grounding method and thermally enhanced PBGA package using the same | Hermes T. Apale, Weddie Aquien, Dario S. Filoteo, Jr., Virgil Ararao, Leo A. Merilo | 2005-04-05 |
| 6861288 | Stacked semiconductor packages and method for the fabrication thereof | Kambhampati Ramakrishna, Seng Guan Chow, Byung Joon Han | 2005-03-01 |
| 6855573 | Integrated circuit package and manufacturing method therefor with unique interconnector | Jian Li, Guruprasad G. Badakere | 2005-02-15 |
| 6841858 | Leadframe for die stacking applications and related die stacking concepts | Kambhampati Ramakrishna, Seng Guan Chow | 2005-01-11 |