Issued Patents 2005
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6927479 | Method of manufacturing a semiconductor package for a die larger than a die pad | — | 2005-08-09 |
| 6861288 | Stacked semiconductor packages and method for the fabrication thereof | Il Kwon Shim, Seng Guan Chow, Byung Joon Han | 2005-03-01 |
| 6841858 | Leadframe for die stacking applications and related die stacking concepts | Il Kwon Shim, Seng Guan Chow | 2005-01-11 |