Issued Patents 2005
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6876069 | Ground plane for exposed package | Jefferey D. Punzalan, Hien Boon Tan, Zheng Zheng, Jae Hak Yee | 2005-04-05 |
| 6861288 | Stacked semiconductor packages and method for the fabrication thereof | Il Kwon Shim, Kambhampati Ramakrishna, Seng Guan Chow | 2005-03-01 |
| 6858470 | Method for fabricating semiconductor packages, and leadframe assemblies for the fabrication thereof | Byung Hoon Ahn | 2005-02-22 |