Issued Patents 2005
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6959854 | Production method for bonded substrates | Isao Yokokawa, Masatake Nakano | 2005-11-01 |
| 6902988 | Method for treating substrates for microelectronics and substrates obtained by said method | Thierry Barge, Bruno Ghyselen, Toshiaki Iwamatsu, Hideki Naruoka, Junichiro Furihata | 2005-06-07 |
| 6900113 | Method for producing bonded wafer and bonded wafer | Masatake Nakano, Isao Yokokawa | 2005-05-31 |
| 6884696 | Method for producing bonding wafer | Hiroji Aga, Shinichi Tomizawa | 2005-04-26 |
| 6846718 | Method for producing SOI wafer and SOI wafer | Hiroji Aga, Naoto Tate, Susumu Kuwabara | 2005-01-25 |