Issued Patents 2005
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6897124 | Method of manufacturing a bonded wafers using a Bernoulli chuck | Hiroji Aga | 2005-05-24 |
| 6846718 | Method for producing SOI wafer and SOI wafer | Hiroji Aga, Susumu Kuwabara, Kiyoshi Mitani | 2005-01-25 |