Issued Patents 2005
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6897124 | Method of manufacturing a bonded wafers using a Bernoulli chuck | Naoto Tate | 2005-05-24 |
| 6884696 | Method for producing bonding wafer | Shinichi Tomizawa, Kiyoshi Mitani | 2005-04-26 |
| 6846718 | Method for producing SOI wafer and SOI wafer | Naoto Tate, Susumu Kuwabara, Kiyoshi Mitani | 2005-01-25 |