Issued Patents 2005
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6902261 | Method and apparatus for bonding a flexible printed circuit cable to an ink jet print head assembly | Jeong-seon Kim, Seo-hyun Cho, Dae-Woo Son, Myung-song Jung | 2005-06-07 |
| 6903451 | Chip scale packages manufactured at wafer level | Nam-Seog Kim, Dong-Hyeon Jang, Heung-Kyu Kwon | 2005-06-07 |
| 6849802 | Semiconductor chip, chip stack package and manufacturing method | Young-Hee Song, Min Young Son | 2005-02-01 |