Issued Patents 2005
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6959856 | Solder bump structure and method for forming a solder bump | Se-Yong Oh | 2005-11-01 |
| 6947336 | Semiconductor device with impedance control circuit | Tae H. Kim, Uk-Rae Cho | 2005-09-20 |
| 6933758 | Synchronous mirror delay circuit with adjustable locking range | Tae H. Kim, Yong-Jin Yoon, Kwang-Jin Lee | 2005-08-23 |
| 6930508 | Integrated circuit with on-chip termination | Uk-Rae Cho, Tae H. Kim | 2005-08-16 |
| 6903451 | Chip scale packages manufactured at wafer level | Dong-Hyeon Jang, Sa-Yoon Kang, Heung-Kyu Kwon | 2005-06-07 |