Issued Patents 2005
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6959856 | Solder bump structure and method for forming a solder bump | Nam-Seog Kim | 2005-11-01 |
| 6952050 | Semiconductor package | Heung-Kyu Kwon, Min-ha Kim, Tae-Je Cho | 2005-10-04 |
| 6943438 | Memory card having a control chip | Min Young Son, Tae-Gyeong Chung | 2005-09-13 |