Issued Patents 2005
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6903451 | Chip scale packages manufactured at wafer level | Nam-Seog Kim, Sa-Yoon Kang, Heung-Kyu Kwon | 2005-06-07 |
DJ
Dong-Hyeon Jang
Overall (2005): #210,159 of 245,428Top 90%
1
Patents 2005