Issued Patents 2005
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6855575 | Semiconductor chip package having a semiconductor chip with center and edge bonding pads and manufacturing method thereof | Ill-heung Choi | 2005-02-15 |
| 6852607 | Wafer level package having a side package | Ming Son, Woong Ky Ha | 2005-02-08 |
| 6849802 | Semiconductor chip, chip stack package and manufacturing method | Sa-Yoon Kang, Min Young Son | 2005-02-01 |