Issued Patents 2005
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6864566 | Duel die package | — | 2005-03-08 |
| 6855575 | Semiconductor chip package having a semiconductor chip with center and edge bonding pads and manufacturing method thereof | Young-Hee Song | 2005-02-15 |