Issued Patents 2005
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6955983 | Methods of forming metal interconnections of semiconductor devices by treating a barrier metal layer | Gil-Heyun Choi, Byung-Hee Kim, Jong-Myeong Lee, Seung-Gil Yang, Jung-Hun Seo | 2005-10-18 |
| 6951814 | Methods for forming a metal wiring layer on an integrated circuit device at reduced temperatures | Byung-Hee Kim, Gil-Heyun Choi, Jung-Hun Seo | 2005-10-04 |
| 6849555 | Wafer processing apparatus and wafer processing method using the same | Jong-Myeong Lee, Byung-Hee Kim, Myoung-Bum Lee, Gil-Heyun Choi | 2005-02-01 |