Issued Patents 2005
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6964922 | Methods for forming metal interconnections for semiconductor devices having multiple metal depositions | Hyeon-Deok Lee, In-Sun Park, Ju-Bum Lee | 2005-11-15 |
| 6955983 | Methods of forming metal interconnections of semiconductor devices by treating a barrier metal layer | Ju-Young Yun, Gil-Heyun Choi, Byung-Hee Kim, Seung-Gil Yang, Jung-Hun Seo | 2005-10-18 |
| 6905960 | Method of forming a contact in a semiconductor device | Hong-Mi Park, Jong-Sik Chun, Hyeon-Deok Lee, In-Sun Park, Ju-Cheol Shin | 2005-06-14 |
| 6849555 | Wafer processing apparatus and wafer processing method using the same | Byung-Hee Kim, Myoung-Bum Lee, Ju-Young Yun, Gil-Heyun Choi | 2005-02-01 |
| 6844627 | Metal film semiconductor device and a method for forming the same | In-Sun Park, Jong-Sik Chun | 2005-01-18 |