Issued Patents 2005
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6955983 | Methods of forming metal interconnections of semiconductor devices by treating a barrier metal layer | Ju-Young Yun, Byung-Hee Kim, Jong-Myeong Lee, Seung-Gil Yang, Jung-Hun Seo | 2005-10-18 |
| 6951814 | Methods for forming a metal wiring layer on an integrated circuit device at reduced temperatures | Byung-Hee Kim, Ju-Young Yun, Jung-Hun Seo | 2005-10-04 |
| 6893915 | Semiconductor device having barrier layer between ruthenium layer and metal layer and method for manufacturing the same | Hee-Sook Park, Seung Hwan Lee, Yun-Jung Lee | 2005-05-17 |
| 6876078 | Semiconductor interconnection structure with TaN and method of forming the same | Byung-Hee Kim, Kyung-In Choi | 2005-04-05 |
| 6849555 | Wafer processing apparatus and wafer processing method using the same | Jong-Myeong Lee, Byung-Hee Kim, Myoung-Bum Lee, Ju-Young Yun | 2005-02-01 |