Issued Patents 2005
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6963124 | Locking of mold compound to conductive substrate panels | Harry Kam Cheng Hong, Hu Ah Lek, Santhiran Nadarajah, Sharon Ko Mei Wan, Chan Peng Yeen +1 more | 2005-11-08 |
| 6932136 | Post singulation die separation apparatus and method for bulk feeding operation | Nikhil Vishwanath Kelkar, Ken Pham, Cheol Han | 2005-08-23 |
| 6933174 | Leadless leadframe package design that provides a greater structural integrity | Harry Kam Cheng Hong, Hu Ah Lek, Santhiran Nadarajah, Sharon Ko Mei Wan, Chan Peng Yeen +1 more | 2005-08-23 |
| 6930377 | Using adhesive materials as insulation coatings for leadless lead frame semiconductor packages | — | 2005-08-16 |
| 6916688 | Apparatus and method for a wafer level chip scale package heat sink | Nikhil Vishwanath Kelkar | 2005-07-12 |
| 6872599 | Enhanced solder joint strength and ease of inspection of leadless leadframe package (LLP) | Felix C. Li, Santhiran Nadarajah, Ah Lek Hu | 2005-03-29 |