Issued Patents 2005
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6872599 | Enhanced solder joint strength and ease of inspection of leadless leadframe package (LLP) | Felix C. Li, Jaime A. Bayan, Santhiran Nadarajah | 2005-03-29 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6872599 | Enhanced solder joint strength and ease of inspection of leadless leadframe package (LLP) | Felix C. Li, Jaime A. Bayan, Santhiran Nadarajah | 2005-03-29 |