Issued Patents 2005
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6956291 | Apparatus and method for forming solder seals for semiconductor flip chip packages | — | 2005-10-18 |
| 6872599 | Enhanced solder joint strength and ease of inspection of leadless leadframe package (LLP) | Jaime A. Bayan, Santhiran Nadarajah, Ah Lek Hu | 2005-03-29 |